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Thermal Stress Analysis of Double-sided PCB with Multiple Chips


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Thermal Stress Analysis of Double-sided PCB with Multiple Chips
WANG Xing-jiuSHEN Yu-nian
School of Sciences,NUST,Nanjing 210094,China
circuit boards thermal stress thermal deformation finite element anisotropic materials
The temperature fields and thermal stress fields of the integrate circuit boards with single chip and multiple chips are simulated using formula for thermic insulants and composite materials by 3D FEM(finite element method).The numerical results indicate that there are great tangential thermal stresses between chips and integration circuit boards,which may do peeled damage to the boards.Different layouts of chips on board are also investigated,which makes an impact on temperature fields and thermal stress fields.Both maximum values of temperature and stresses can be decreased effectively when the chips are distributed reasonably.


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Last Update: 2010-04-30