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Interferometry measurement of back surface temperature of siliconplate after interaction with millisecond laser(PDF)

《南京理工大学学报》(自然科学版)[ISSN:1005-9830/CN:32-1397/N]

Issue:
2018年02期
Page:
148-
Research Field:
Publishing date:

Info

Title:
Interferometry measurement of back surface temperature of siliconplate after interaction with millisecond laser
Author(s):
Zhang LiangNi XiaowuLu Jian
School of Science,Nanjing University of Science and Technology,Nanjing 210094,China
Keywords:
interferometry measurement surface temperature gasification rate melt splash
PACS:
TN305
DOI:
10.14177/j.cnki.32-1397n.2018.42.02.003
Abstract:
The steam velocity and temperature variations of the silicon plate after its interaction with the millisecond laser are studied. Sequence interference pictures of interaction between the 1 ms pulse width and 5.82×103 J/cm2 energy density laser and the 0.3 mm thickness silicon plate are obtained by experiments. These sequence interference pictures show that,after the silicon plate being irradiated by 466 μs,the gasification phenomenon is produced on the front and the back surfaces of the silicon plate; and after the silicon plate being irradiated 699 μs,there are melt splashes producing on the front and back surfaces of the silicon plate. According to the position change and the time interval of the interference fringes of two adjacent interference pictures,the gasification rate of the steam on the back surface after 466~699 μs laser irradiation is calculated(20.47±0.08 m/s). By using Rankine-Hugoniot relations,the kinetic theory of gases and the mass,momentum,energy conservation equation of the Knudsen layer,the vapor pressure of the back surface is obtained; And by the Clapeyron-Clausius equation,the temperature of the back surface of the silicon plate after 466~699 μs laser irradiation is calculated(3551.2±2 K),and the result is consistent with that of the literature. Finally,the mechanism of molten splash is analyzed through the calculated temperature.

References:

[1] 杨成娟,田延岭,崔良玉. 超快激光辐照诱导金属钛的变化[J]. 红外与激光工程,2015(7):2002-2007.
Yang Chengjuan,Tian Yanling,Cui Liangyu. Ultrafast laser-induced changes in titanium[J]. Infrared and Laser Engineering,2015(7):2002-2007.
[2]冯爱新,庄绪华,薛伟. 1064 nm、532 nm、355 nm波长脉冲激光辐照多晶硅损伤特性研究[J]. 红外与激光工程,2015(2):461-465.
Feng Aixin,Zhuang Xuhua,Xue Wei. Damage characteristics of polysilicon under wavelengths of 1064 nm,532 nm and 355 nm laser irradiation[J]. Infrared and Laser Engineering,2015(2):461-465.
[3]戴罡,陆建,刘剑. 使用长脉冲高能激光对石英玻璃打孔[J]. 光学精密工程,2011(2):380-386.
Dai Gang,Lu Jian,Liu Jian. Experiment of long pulse high energy laser drilling on silica glass[J]. Optics and Precision Engineering,2011(2):380-386.
[4]齐立涛. 真空条件下不同波长固体激光烧蚀单晶硅的实验研究[J]. 中国光学,2014(3):442-448.
Qi Litao. Different wavelength solid-state laser ablation of silicon wafer in vacuum[J]. Chinese Optics,2014(3):442-448.
[5]汤伟,吉桐伯,郭劲. 高重频CO2激光损伤HgCdTe晶体的数值分析[J]. 中国光学,2013(5):736-742.
Tang Wei,Ji Tongbo,Guo Jin. Numerical analysis of HgCdTe crystal damaged by high repetition frequency CO2 laser[J]. Chinese Optics,2013(5):736-742.
[6]秦渊,毕娟,倪晓武,毫秒激光金属打孔的解析和实验[J]. 光学精密工程,2011(2):340-347.
Qin Yuan,Bi Juan,Ni Xiaowu,Analysis and experiment on millisecond pulsed laser drilling of metals[J]. Optics and Precision Engineering,2011(2):340-347.
[7]Sha T,Wu Benxin,Yun Z,et al. Thermal modeling and experimental study of infrared nanosecond laser ablation of silicon[J]. Journal of Applied Physics,2009,106:123507.
[8]Lu Quanming,Mao S S,Mao Xianglei,et al. Theory analysis of wavelength dependence of laser-induced phase explosion of silicon[J]. Journal of Applied Physics,2008,104:083301.
[9]Schneider M,Berthe L,Fabbro R,et al. Gas investigation for laser drilling[J]. Journal of Laser Applications,2007,19(3):165-173.
[10]Voisey K T,Kudesia S S,Rodden W S O,et al. Melt ejection during laser drilling of metals[J]. Materials Science Engineering,2003,A356:414-424.
[11]He X,Norris J T,Fuerschbach P W,et al. Liquid metal expulsion during laser spot welding of 304 stainless steel[J]. Journal of Physics D(Applied Physics),2006,39(3):525-534.
[12]He X,Debroy T,Fuerschbach P W. Alloying element vaporization during laser spot welding of stainless steel[J]. Journal of Physics D(Applied Physics),2003,36(23):3079-3088.
[13]Cho J H,Na S J. Implementation of real-time multiple reflection and Fresnel absorption of laser beam in keyhole[J]. Journal of Physics D(Applied Physics),2006,39(24):5372-5379.
[14]Song K H,Xu Xianfan. Explosive phase transformation in excimer laser ablation[J]. Applied Surface Scicence,1998,127/129:111-116.
[15]Yilbas B S,Sami M. Liquid ejection and possible nucleate boiling mechanisms in relation to the laser drilling process[J]. Journal of Physics D(Applied Physics),1997,30(14):1996-2005.
[16]Ki H,Mohanty P S,Mazumder J. Modelling of high-density laser-material interaction using fast level set method[J]. Journal of Physics D(Applied Physics),2001,34(3):364-372.
[17]Doubenskaia M,Smurov I. Surface temperature evolution in pulsed laser action of millisecond range[J]. Applied Surface Science,2006,252:4472-4476.
[18]Ignatiev M,Smurov I Y,Flamant G,et al. Two-dimensional resolution pyrometer for real-time monitoring of temperature image in laser materials processing[J]. Applied Surface Science,1997,109/110:498-508.
[19]Kasparov K N,Ivlev G D,Belozerova L I,et al. Photoemission measurements of temperature in pulsed laser heating of various materials[J]. Journal of Engineering Physics and Thermophysics,2012,85(1):210-215.
[20]Aden M,Beyer E,Herziger G. Laser-induced vaporisation of metal as a Riemann problem[J]. Journal of Physics D(Applied Physics),1990,23(6):655-661.
[21]陆建,倪晓武,贺安之. 激光与材料相互作用物理学[M]. 北京:机械工业出版社,1996.
[22]张梁,倪晓武,陆建. 长脉冲激光与硅相互作用气化过程的数值模拟[J]. 光学精密工程,2011(2):837-844.
Zhang Liang,Ni Xiaowu,Lu Jian,Numerical simulation of vaporization effect of long pilsed laser interaction with silicon[J]. Optics and Precision Engineering,2011(2):837-844.

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Last Update: 2018-04-30