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Influences of shape and filling material of through silicon via on thermal stress(PDF)


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Influences of shape and filling material of through silicon via on thermal stress
Wei Li 1Lu Xiangning2Guo Yujing1
1. Provincial Experimental Teaching Demonstration Center of Mechanical Engineering, Tangshan College,Tangshan 063000,China; 2.School of Mechanical and Electrical Engineering,Jiangsu Normal University,Xuzhou 221116,China
through silicon via thermal stress finite element analysis copper filling
TN305; TG156
A cylinder through silicon via(TSV)and a circular truncated cone TSV are simulated using finite element analysis to research the influences of shape and filling materials of TSV on the thermodynamic performance of the structure. For the cylinder TSV,the depth to width ratio or the radius of filling copper are changed to analyze the thermal stress; for the circular truncated cone TSV,a radius or the ratio between upper end radius and under end radius are changed to analyze the thermal stress. The simulation results show that the maximum thermal stress appears at the maximum deformation of the cylinder TSV and the circular truncated cone TSV,and the minimum thermal stress appears at the copper filling part; for the cylinder TSV,the greater the depth-to-width radio is,the smaller the thermal stress is,and the bigger the radius of copper filling is,the bigger the thermal stress is; for the circular truncated cone TSV,the bigger the ratio between upper end radius and under end radius is,the bigger the thermal stress is,and as the ratio between upper end radius and under end radius being equal,the thermal stress increases first and then decreases with the end radius increasing.


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Last Update: 2018-06-30