[1]洪宇平,李强,宣益民.小型平板热管传热实验研究[J].南京理工大学学报(自然科学版),2001,(01):32-35.
 HongYuping LiQiang XuanYimin.Experimental Investigation on Heat Transfer of Miniature Flat Plate Heat Pipes[J].Journal of Nanjing University of Science and Technology,2001,(01):32-35.
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小型平板热管传热实验研究()
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《南京理工大学学报》(自然科学版)[ISSN:1005-9830/CN:32-1397/N]

卷:
期数:
2001年01期
页码:
32-35
栏目:
出版日期:
2001-02-28

文章信息/Info

Title:
Experimental Investigation on Heat Transfer of Miniature Flat Plate Heat Pipes
作者:
洪宇平李强宣益民
南京理工大学动力工程学院!南京210094
Author(s):
HongYuping LiQiang XuanYimin
School of Power Engineering,NUST,Nanjing 210094
关键词:
平板 热管冷却 电子元件 传热
Keywords:
f latplate heat pipe cooling elect ronic components heat t ransfer
分类号:
TK124
摘要:
研究用于电子器件高效冷却的小型平板热管 (简称为热板 )的传热机理 ,提出热板设计方案 ;采用粉末冶金的方法在热板蒸发端烧结毛细多孔层 ,强化了工质的沸腾换热过程 ;对热板进行了传热稳态和瞬态性能测试 ,分析工质充装量、毛细多孔层厚度、热板工作方式等因素对热板传热性能的影响
Abstract:
This paper develops a fla-t plate heat pipe for cooling electronic component of high power. A layer of sintered porous media is applied to the evaporation surface of the FPHP to enhance the heat transfer during the boiling of the working fluid. The transient and steady temperature dist ribut ion of the FPHP is measured, the effects of several factors, such as the working fluid filling rate, porous layer filling rate on the performance of the FPHP, are analyzed.

参考文献/References:

1 克劳斯阿伦D1 电子设备的热控制与分析. 北京: 国防工业出版社, 1992
2 马同泽, 侯增祺1 热管1 北京: 科学出版社, 1983
3 马重芳1 强化传热1 北京: 科学技术出版社, 1990

备注/Memo

备注/Memo:
T his paper is dedicated to Prof.W. Roetzel. s 65 bir thday.
洪宇平 男 25 岁 硕士生
更新日期/Last Update: 2013-03-25