参考文献/References:
[1]Liu J. Conductive adhes ives fo r e lectronics packag ing
[M ]. Isle of M an: E lectrochem ica l Pub lication
Ltd, 1999.
[2] Fr iedr ich K, Fak irov S, Zhang Z. Po lym er com posites:
from nano- sca le to m acro- sca le [M ]. Be rlin:
Spr ing er, 2006.
[3] Kough ia C, Kasap S, Capper P. H andbook of e lectron ic
and photon ic mater ials[M ]. Berlin: Springer, 2006.
[4] Xie B, Sh iX Q, DingH. Understanding o f delam ination
m echanism o f an iso tropic conductive film (ACF) bond ing
in th in liqu id crysta l disp lay ( LCD) module[ J]. IEEE
Transactions on Components and Packag ing Technolog
ies, 2007, 30( 3): 509- 516.
[5] Chen W T, Ne lson C W. Therm a l stress in bo lted
jo ints [ J ]. IBM Journal of Research and Deve lopm
ent, 1979, 23: 178- 188.
[6] Buratynski E K. Analysis of bend ing and shear ing of
tr-i layer lam inations for so lder jo int re liab ility [ J ].
ASME Journa l of Electron ic Packag ing, 1998, 9
( 120): 221- 228.
[7] Swe tt D W, Shillett G R. Edge stress in a composite
strip subjected to ax ia l temperature grad ients: Part I:
Deve lopm ent of the theoretica l so lution[ J]. Journa l o f
Com po siteM ater ia ls, 1990( 31): 1334- 1361.
[8] Suh irE. Approx im a te eva luation of the e lastic therm al
stresses in a th in fabr ica te on a very th ich c ircular substra
te [ J] . Journa l of E lectronic Packag ing, 1994,
116: 171- 176.
[9] Xie W D, Suresh K, S itaram an. Interfac ia l therm al
stress ana lysis o f an iso trop ic m ult-i layered e lectronic
packag ing structures[ J]. ASME Journa l of E lectronic
Packag ing, 2000, 122: 61- 66.
[ 10 ] Yu Q, Sh ira toriM, W ang S B. Therm al conduction
and therm al stress ana ly sis o f surface m ount assem bly
w ith a so lder jo int elem ent[ J]. M echanica ls andM ater
ials for E lec tron ic Packag ing, 1994, 2: 205- 211.
[11] W ang A S, Crossm an FW. Edge effects on therm a lly
induced stresses in com pos ite lam inates[ J]. Journal o f
Com po siteM ater ia ls, 1977, 11: 300- 312.
[12] Lau J H. A note on the calculation packag ing o f therm
a l stresses in electronic packag ing by fin ite elem ent
m ethods[ J]. Journa l o f E lectronic Packag ing, 1989,
111: 313- 320.
[13] 严宗达, 王洪礼. 热应力[M ]. 北京: 高等教育出版
社, 1993.
[14] 屠传经, 沈珞婵, 吴子静. 热传导[M ]. 北京: 高等
教育出版社, 1992.
175
相似文献/References:
[1]苏晓鹏,钱林方,戴劲松,等.高射速自动机身管热容量及热应力分析[J].南京理工大学学报(自然科学版),2009,(04):469.
SU Xiao-peng,QIAN Lin-fang,DAI Jin-song,et al.Thermal Capacity and Thermal Stress Analysis of Rapid-fire Gun Barrel[J].Journal of Nanjing University of Science and Technology,2009,(02):469.
[2]陈龙淼,钱林方.基于热效应的复合材料身管强度分析[J].南京理工大学学报(自然科学版),2008,(06):710.
CHEN Long-miao,QIAN Lin-fang.Strength of Composite Materials Barrels Based on Thermal Effect[J].Journal of Nanjing University of Science and Technology,2008,(02):710.
[3]吴永海,徐诚,李峰,等.承受热冲击的大口径机枪枪管的热效应分析[J].南京理工大学学报(自然科学版),2007,(01):1.
WU Yong-hai,XU Cheng,LI Feng,et al.Thermal Effect of Large-calibre Machine-gun Barrel Subjected to Thermal Shock[J].Journal of Nanjing University of Science and Technology,2007,(02):1.
[4]韩育礼.圆筒及武器身管的热应力分析与计算[J].南京理工大学学报(自然科学版),1981,(02):22.
[5]魏 丽,陆向宁,郭玉静.硅通孔形状和填充材料对热应力的影响[J].南京理工大学学报(自然科学版),2018,42(03):364.[doi:10.14177/j.cnki.32-1397n.2018.42.03.016]
Wei Li,Lu Xiangning,Guo Yujing.Influences of shape and filling material of through silicon via on thermal stress[J].Journal of Nanjing University of Science and Technology,2018,42(02):364.[doi:10.14177/j.cnki.32-1397n.2018.42.03.016]