[1]董雅洁,李 强,张 雪.平流层电子设备温度特征的仿真与试验研究[J].南京理工大学学报(自然科学版),2019,43(01):86.[doi:10.14177/j.cnki.32-1397n.2019.43.01.012]
　Dong Yajie,Li Qiang,Zhang Xue.Numerical simulation and experiment for thermal behaviorof stratospheric electronic equipment[J].Journal of Nanjing University of Science and Technology,2019,43(01):86.[doi:10.14177/j.cnki.32-1397n.2019.43.01.012]
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平流层电子设备温度特征的仿真与试验研究()
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《南京理工大学学报》（自然科学版）[ISSN:1005-9830/CN:32-1397/N]

卷:
43卷
期数:
2019年01期
页码:
86
栏目:
出版日期:
2019-02-28

文章信息/Info

Title:
Numerical simulation and experiment for thermal behaviorof stratospheric electronic equipment
文章编号:
1005-9830(2019)01-0086-07
作者:
董雅洁; 李 强; 张 雪
南京理工大学 能源与动力工程学院,江苏 南京 210094
Author(s):
Dong Yajie; Li Qiang; Zhang Xue
School of Energy and Power Engineering,Nanjing University of Scienceand Technology,Nanjing 210094,China
关键词:
平流层;  电子设备;  对流散热;  太阳辐射;  风速;  强迫对流;  温度;  数值仿真;  试验
Keywords:
stratosphere;  electronic equipment;  convection hear dissipation;  solar radiation;  wind velocity;  forced convection;  temperature;  numerical simulation;  experiment
分类号:
TK12
DOI:
10.14177/j.cnki.32-1397n.2019.43.01.012
摘要:
为了研究平流层电子设备的温度特征,该文考虑温度、压强、风速、地球和太阳辐射等平流层环境以及电子设备结构、材料和功率等参数,建立了平流层电子设备温度的理论计算模型,分析了太阳辐射、风速、发热功率等参数对电子设备温度的影响规律。通过平流层环境试验,验证了理论模型的正确性。结果表明:对于平流层电子设备而言,强迫对流和辐射两种散热模式都会影响电子设备的温度,且对流散热是主要因素。风速为3 m/s时,电子设备对流散热量占58.5%,风速为15 m/s时,对流散热量占87.9%。在进行热设计时需要综合考虑这两个因素的影响。
Abstract:
A theoretical model is established to investigate the thermal characteristics of stratospheric electronic equipment,considering the stratosphere environment such as temperature,pressure,wind velocity,earth and solar radiation,as well as the structure,materials and power of the electronic equipment. The influences of solar radiation,wind velocity,power and other parameters on the temperature of electronic equipment are analyzed. An experiment is conducted and discussed to prove the reliability of the mathematical model. The results show that:forced convection and radiation can affect the temperature of the stratospheric electronic equipment,and the convection heat dissipation is the main factor. The convection heat dissipation accounts for 87.9%,when the wind velocity is 15 m/s and the convection heat dissipation accounts for 58.5% when the wind velocity is 3 m/s. The two factors should be taken into consideration in the process of thermal design.

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备注/Memo

备注/Memo:
收稿日期:2018-01-29 修回日期:2018-09-07
基金项目:国家杰出青年科学基金(51225602)
作者简介:董雅洁(1994-),女,硕士生,主要研究方向:电子设备散热,E-mail:18362966603@163.com; 通讯作者:李强(1971-),男,教授,博士生导师,主要研究方向:强化传热技术,E-mail:liqiang@njust.edu.cn。
引文格式:董雅洁,李强,张雪. 平流层电子设备温度特征的仿真与试验研究[J]. 南京理工大学学报,2019,43(1):86-93.
投稿网址:http://zrxuebao.njust.edu.cn
更新日期/Last Update: 2019-02-28