[1]王兴久,沈煜年.多芯片双面PCB的热应力分析[J].南京理工大学学报(自然科学版),2010,(02):170-175.
 WANG Xing-jiu,SHEN Yu-nian.Thermal Stress Analysis of Double-sided PCB with Multiple Chips[J].Journal of Nanjing University of Science and Technology,2010,(02):170-175.
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多芯片双面PCB的热应力分析
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《南京理工大学学报》(自然科学版)[ISSN:1005-9830/CN:32-1397/N]

卷:
期数:
2010年02期
页码:
170-175
栏目:
出版日期:
2010-04-30

文章信息/Info

Title:
Thermal Stress Analysis of Double-sided PCB with Multiple Chips
作者:
王兴久 沈煜年
南京理工大学理学院, 江苏南京210094
Author(s):
WANG Xing-jiuSHEN Yu-nian
School of Sciences,NUST,Nanjing 210094,China
关键词:
电路板 热应力 热变形 有限元 各向异性材料
Keywords:
circuit boards thermal stress thermal deformation finite element anisotropic materials
分类号:
TN41
摘要:
运用隔热材料和复合材料的计算公式,采用三维有限元方法,计算了单芯片组和多芯片组集成电路板的温度场和热应力场。数值模拟结果显示,芯片组与印刷电路板之间存在较大的剪应力,这可能是芯片剥离的原因之一。芯片位置对电路板的温度场和热应力场分布影响很大。合理地布置各芯片,可有效降低电路板的温度极值和应力极值。
Abstract:
The temperature fields and thermal stress fields of the integrate circuit boards with single chip and multiple chips are simulated using formula for thermic insulants and composite materials by 3D FEM(finite element method).The numerical results indicate that there are great tangential thermal stresses between chips and integration circuit boards,which may do peeled damage to the boards.Different layouts of chips on board are also investigated,which makes an impact on temperature fields and thermal stress fields.Both maximum values of temperature and stresses can be decreased effectively when the chips are distributed reasonably.

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备注/Memo

备注/Memo:
作者简介: 王兴久( 1965- ) , 男, 工程师, 主要研究方向: 固体力学的工程应用, E-mail: wangnust@ yahoo. com. cn。
更新日期/Last Update: 2010-04-30