[1]魏 丽,陆向宁,郭玉静.硅通孔形状和填充材料对热应力的影响[J].南京理工大学学报(自然科学版),2018,42(03):364.[doi:10.14177/j.cnki.32-1397n.2018.42.03.016 ]
 Wei Li,Lu Xiangning,Guo Yujing.Influences of shape and filling material of through silicon via on thermal stress[J].Journal of Nanjing University of Science and Technology,2018,42(03):364.[doi:10.14177/j.cnki.32-1397n.2018.42.03.016 ]
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硅通孔形状和填充材料对热应力的影响
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《南京理工大学学报》(自然科学版)[ISSN:1005-9830/CN:32-1397/N]

卷:
42卷
期数:
2018年03期
页码:
364
栏目:
出版日期:
2018-06-30

文章信息/Info

Title:
Influences of shape and filling material of through silicon via on thermal stress
文章编号:
1005-9830(2018)03-0364-06
作者:
魏 丽1陆向宁2郭玉静1
1.唐山学院 机械工程省级实验教学示范中心,河北 唐山 063000; 2.江苏师范大学 机电工程学院,江苏 徐州 221116
Author(s):
Wei Li 1Lu Xiangning2Guo Yujing1
1. Provincial Experimental Teaching Demonstration Center of Mechanical Engineering, Tangshan College,Tangshan 063000,China; 2.School of Mechanical and Electrical Engineering,Jiangsu Normal University,Xuzhou 221116,China
关键词:
硅通孔 热应力 有限元分析 Cu填充
Keywords:
through silicon via thermal stress finite element analysis copper filling
分类号:
TN305; TG156
DOI:
10.14177/j.cnki.32-1397n.2018.42.03.016
摘要:
为研究硅通孔(TSV)的形状和填充材料对结构热力学性能的影响,采用有限元分析方法对单个圆柱形和圆台形结构的TSV模型进行仿真分析。对于圆柱形TSV,改变通孔的深宽比或Cu填充部分半径,分析结构的热应力变化; 对于圆台形TSV,改变一端半径或上下端半径比分析热应力变化。仿真分析表明,圆柱形TSV和圆台形TSV的最大热应力都出现在变形最大处,最小热应力都出现在Cu填充部分; 圆柱形TSV的深宽比越大热应力越小,Cu填充部分半径越大热应力越大; 圆台形TSV的上下端半径比越大热应力越大,当上下端半径同时由小变大而上下端半径比不变时,热应力先增大后减小。
Abstract:
A cylinder through silicon via(TSV)and a circular truncated cone TSV are simulated using finite element analysis to research the influences of shape and filling materials of TSV on the thermodynamic performance of the structure. For the cylinder TSV,the depth to width ratio or the radius of filling copper are changed to analyze the thermal stress; for the circular truncated cone TSV,a radius or the ratio between upper end radius and under end radius are changed to analyze the thermal stress. The simulation results show that the maximum thermal stress appears at the maximum deformation of the cylinder TSV and the circular truncated cone TSV,and the minimum thermal stress appears at the copper filling part; for the cylinder TSV,the greater the depth-to-width radio is,the smaller the thermal stress is,and the bigger the radius of copper filling is,the bigger the thermal stress is; for the circular truncated cone TSV,the bigger the ratio between upper end radius and under end radius is,the bigger the thermal stress is,and as the ratio between upper end radius and under end radius being equal,the thermal stress increases first and then decreases with the end radius increasing.

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备注/Memo

备注/Memo:
收稿日期:2017-11-13 修回日期:2018-02-26
基金项目:国家自然科学基金(51675250)
作者简介:魏丽(1981-),女,讲师,主要研究方向:光学测试技术、微电子系统及嵌入式系统,E-mail:ysuweili@163.com; 通讯作者:陆向宁(1981-),男,副教授,主要研究方向:微电子封装及其可靠性分析,E-mail:lxnam89@163.com。
引文格式:魏丽,陆向宁,郭玉静. 硅通孔形状和填充材料对热应力的影响[J]. 南京理工大学学报,2018,42(3):364-369.
投稿网址:http://zrxuebao.njust.edu.cn
更新日期/Last Update: 2018-06-30